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    1. 中文English
      中文English

      Package List

      TITLE

      Package List

      • DDR2
      • DDR3
      • DDR4
      • LPDDR
      • eMMC/MCP
      • NAND
      • LOGIC

      Package Type

      Package Size
      Ball/Lead Pitch
      Ball Size

      60B wBGA

      8x10x1.2(Max.)

      0.8mm

      0.45mm

      8x10.5x1.2(Max.)

      0.8mm

      0.45mm

      9x11.5x1.2(Max.)

      0.8mm

      0.45mm

      84B wBGA

      8x12.5x1.2(Max.)

      0.8mm

      0.45mm


      Package TypePackage SizeBall SizeBall/Lead pitch

      78B wBGA

      7.5x11x1.2(Max.)

      0.45mm

      0.8mm

      8x10.5x1.2(Max.)

      0.45mm

      0.8mm

      9x10.5x1.2(Max.)

      0.45mm

      0.8mm

      9x11.1X1.2(Max.)

      0.45mm

      0.8mm

      9.4x11.1X1.2(Max.)

      0.45mm

      0.8mm

      10.5x12x1.2(Max.)

      0.45mm

      0.8mm

      78B FCBGA

      9x10.5x1.2(Max.)

      0.45mm

      0.8mm

      96B wBGA

      9x13x1.2(Max.)

      0.45mm

      0.8mm


      Package Type

      Package Size

      Ball Size

      Ball/Lead pitch

      78B wBGA

      8x12x1.2(Max.)

      0.45mm

      0.8mm

      9x10.5x1.2(Max.)

      0.45mm

      0.8mm

      78B wBGA

      9x13x1.2(Max.)

      0.45mm

      0.8mm

      9x14x1.2(Max.)

      0.45mm

      0.8mm


      Product Type

      Package Type

      Package Size

      Ball Size

      Ball/Lead pitch

      LPDDR2

      162B FBGA

      12x12x1.1(Max.)

      0.3/0.35mm

      0.5mm

      LPDDR4

      200B FBGA

      10x14.5x0.85(Max.)

      0.3mm

      0.8x0.65mm


      Product TypePackage TypePackage SizeBall SizeBall/Lead pitch

      eMMC

      153B FBGA

      11.5x13x1.0(Max.)

      0.3mm

      0.5mm

      MCP

      162B FBGA

      11.5x13x1.0(Max.)

      0.3mm

      0.5mm

      9x11.5x1.0(Max.)

      0.3mm

      0.5mm

      8x10.5x1.0(Max.)

      0.3mm

      0.5mm

      11.5x13x1.0(Max.)

      0.3mm

      0.5mm


      Product   Type

      Package Type

      Package Size

      Ball Size

      Ball/Lead pitch

      NAND

      48 TSOP

      12x18.4x1.0mm

      -

      0.5mm

      63B FBGA

      10.5x13x1.0mm

      0.45mm

      0.8mm

      132B FBGA

      12x18x1.1mm

      0.45mm

      1.0mm

      12x18x1.4mm

      13x18x1.1mm

      13x18x1.4mm

      152B FBGA

      14x18x1.0mm

      0.45mm

      1.0mm

      14x18x1.4mm

      272B FBGA

      14x18x1.4mm

      0.45mm

      0.8mm

      UDP

      11.3x24.8x1.4mm

      -

      -

      Micro SD

      11x15x1.1mm

      -

      -

      Nano Memory

      8.8x12.3x0.78mm

      -

      -

      SIP - USB

      11.1x16x1.11mm

      -

      -

      11.1x18x1.11mm



      Product TypePackage TypePackage SizeBall SizeBall/Lead pitch

      Logic

      130B FBGA

      8x9x1.0/1.05(Max.)

      0.30mm

      0.65mm

      144B FBGA

      10x10x1.2(Max.)

      0.35mm

      0.80mm

      324B FCCSP

      15x15x2.0(Max.)

      0.45mm

      0.80mm

      484B FCCSP

      19x19x2.0(Max.)

      0.45mm

      0.80mm


      Test Platform

      TITLE

      Test Platform

      • DRAM
      • NAND
      • DIMM
      • LOGIC

      DDR2, DDR3
      DDR4, LPDDR4
      DDR5, LPDDR5

      Burn In

      image.png 
               P6502 - 40Mbps

       image.png

        P6502 - 40Mbps

      image.png

        H5620 - 400Mbps

      image.png

        H5620 - 200/400Mbps

      Core Test

      image.png

        T5581 - 500Mbps

        T5593 - 1.066Gbs

      image.png

        T5588 - 856Mbps

      Speed Test

      image.png

        T5593 - 1.066Gbs

        T5503 - 2.286Gbps

      image.png
               T5503HS - 4.5Gbps
                T5503HS2 - 7Gbps

      image.png
               T5503HS2 - 7Gbps


      image.png

        T5831 - 1.2Gbps


             image.png   UNI-480                      image.png  HT3309


              5eeed4342684b.png                  5eeed52a21d5a.png

      image.png


                  image.png
              V93000 

                Testing capabilities for RF and mixed-signal ICs

                   -> PS1600 @ 1600Mbps 
                   -> RF solutions


      Advantages

      TITLE

      Advantages

      • High Stacking
      • Test Solution
      • 2D Marking

      With SDBG process, high accuracy die bonder and compression mold, TJS has full capability to provide the high stacking solutions.  

      8D16D
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      5eee163e98522.png

      5eee164e523cf.png5eee165668dc6.png



      TJS's professional Test R&D Team focus on program development, hardware design and automated integration, etc.
       Program Coding 
       Hardware Design  ->  
      Burn-In Board | Hifix/DSA | LoadBoard | Socket | Change Kit

      ③ Automation Integration


      Test Platform

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           5eeeac1202460.png            5eeeac60cd7b4.png




      image.png

      Package Roadmap

      TITLE

      Package Roadmap

      • Memory IC
      • Function IC
      • Bumping

      5eee0a513b580.png

      5eee0a7f330f1.png

      圖片.png
      圖片.png
      免费看黄色视频
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