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    1. 中文English
      中文English

      Turnkey Solution

      TITLE

      Turnkey Solution

      DRAM 

      DDR2 / DDR3 / DDR4 / DDR5 / LP2 / LP4 / LP5
        
       Burn in; Core; Speed; Module

      NAND 

      SSD / Micro SD / U-Disk / CF Card / UDP/ eMMC
         
      Burn in; Core; Speed; Module

      Function IC 

         FCCSP / FCBGA / Hybrid FCCSP + MUF
         Digital; Wireless/RF;  SoC; Power/Analog

      Package Design

      TITLE

      Package Design

      image.png
        AutoCAD 

       ? Lead frame design
       ? Bonding diagram generation
       ? POD Drawing creation etc.

      5eee42cb56d96.png 
       Cadence APD 

       ? Substrate routing

       image.png
       Ansys Icepak 

       ? Junction to ambient thermal resistance
       ? Junction to board thermal resistance 
       ? Junction to case thermal resistance

      Package Design

      TITLE

      Package Design

      5eee11d7efb9c.png
           (Strategic Partnership)
      TJS have a strategic partnering relationship with Jiangsu Nepes.
      We leverages each respective expertise to jointly develop and market technologies for Flipchip turnkey solution.

      --------------------------------------------------------------
      ? 8“ Gold Bump(including COG/COF)

      ? 8“ Solder Bump/WLCSP, Copper Pillar Bump、RDL
      ? 12"CopperPillar Bump 
      ? CP/F & Backend Full Turnkey Service
      免费看黄色视频
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